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Catalog No. H00274-31041
Part No. H00274-31041
Supplier Welch Materials Inc.
Ultisil HILIC Amphion II, 5 μm, 4.6 × 150 mm
Net Price
592
Availability

In stock

DESCRIPTION
Ultisil HILIC Amphion II is a newly developed HILIC column, using amphion-bonded silica as packing material. It applies to the separation of most polar compounds, using acetonitrile or Water other than ion-pairing reagents as mobile phase. The Amphion, containing both Positive Charge Centre and Negative Charge Centre, brings high retention for acid and alkaline compounds through ion-exchange mechanism. Compared with common HILIC packing materials like silica and amino groups, the Amphion-bonded packing material provides better reproducibility and stability.
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